AM Technology co., Ltd

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About Products

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

D&G Division

[ENG] D&G사업부

Full Auto Back Grinding Machine

Feature

    ◆ Substantial and Simple Structure

    ◆ Auto Workpiece Thickness Measure system

    ◆ Auto Dressing system

    ◆ Auto Loading/Unloading system

    ◆ Auto Cleaning & Dry

    ◆ Optimized Software

Applications

◆Semiconductor Packaging: Strip mold & Composite, Fan-out wafer level package, PLP, PCB board, Finger print

◆Wafer Processing: Silicon wafer, Sic wafer, Sapphire

◆Etc: Ceramic, Metal, Glass, Si ring, Electrode, LED mold, Carbons, Plastic

 

Specifications

 Model

 Unit

 HRG-150

 VRG-250F

 VRG-300F

 VRG-500

 Wheel Spindle

 1.5kW 3,000rpm

 3.5kW 2,000rpm

 7.0kW 2,000rpm

 7.0kW 2,000rpm

 Work Spindle

 0.2kW 400rpm

 0.75kW 200rpm

 1.5kW 200rpm

 2.2kW 200rpm

 Work piece size

 mm

 Ø150

 Ø250

 Ø300

 Ø500

 Useable stroke

 mm

 70

 100

 100

 130

 Grinding speed

 mm/min

 0.0001~1

 0.0001~1

 0.0001~1

 0.0001~1

 Resolution

 mm

 ±0.001

 ±0.001

 ±0.001

 ±0.001

 Accuracy

 mm

 ±0.001

 ±0.001

±0.001 

±0.002 

 Repeating accuracy

 mm

 ±0.001

 ±0.001

 ±0.001

 ±0.001

 Automatic THK Measuring

 Option

 Option

 Option

 Option

 Automatic Dressing

 Option

 Option

 Option

 Option

 Dimension

 mm

 1400*780*1520

 950*1230*2045

 1220*1410*2260

 1220*1410*2370

 Weight

 kg

 1,400

 1,800

 2,100

 2,300


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