AM Technology co., Ltd

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About Products

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

D&G Division

[ENG] D&G사업부

Semi Auto Back Grinding Machine

Feature

    ◆ Substantial and Simple Structure

    ◆ Auto Workpiece Thickness Measureing System

    ◆ Auto Dressing Function

    ◆ Low fracture rate of products

    ◆ Optimized Software

Applications

◆Semiconductor Packaging: Strip mold & Composite, Fan-out wafer level package, PLP, PCB board, Finger print

◆Wafer Processing: Silicon wafer, Sic wafer, Sapphire

◆Etc: Ceramic, Metal, Glass, Si ring, Electrode, LED mold, Carbons, Plastic

Specifications

 Model

 Unit

 HRG-150

 VRG-250F

 VRG-300F

 VRG-500

 Wheel Spindle

 3.5kW 3,000rpm

 3.5kW 2,000rpm

 9.5kW 4,000rpm

 9.5kW 4,000rpm

 Work Spindle

 0.4kW 400rpm

 0.75kW 400rpm

 1.5kW 400rpm

 2kW 240rpm

 Work piece size

 mm

 Ø150

 Ø200

 Ø300

 Ø500

 Useable stroke

 mm

 70

 100

 130

 130

 Grinding speed

 mm/min

 0.0001~30

 0.0001~30

 0.0001~30

 0.0001~30

 Resolution

 mm

 0.0001

 0.0001

 0.0001

 0.0001

 Accuracy

 mm

 0.001

 0.001

 0.001 

0.001 

 Repeating accuracy

 mm

 ±0.001

 ±0.001

 ±0.001

 ±0.001

 Automatic THK Measuring

 Option

 Option

 Option

 Option

 Automatic Dressing

 Option

 Option

 Option

 Option

 Dimension

 mm

 1400*785*1535

 1230*950*2045

 1220*1410*2260

 1380*1250*2062

 Weight

 kg

 1,400

 1,400

 2,500

 2,600


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